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Wen Ko, PhD

Wen Ko, PhDschematic of package layers; L & R tissue slides: Caption 1: Diagram of the packaged pressure telemetry device. Caption 2: The two pictures show great similarity in the morphology of the tissues. Left is the control group of healthy skin. Right is the tissue around the implant. The pathological examinations showed normal tissue response to the implant; no evidence suggesting foreign body giant cell reaction, no scar formation, and no inflammation.Dr. Wen Ko was principal investigator on the Micropackage Technology for Implantable Microsystems project. Implanted medical devices containing active electronics currently need to be hermetically sealed in titanium or ceramic packages, which limit their size, mechanical flexibility and integration with biological tissues. Investigators with the APT Center are developing unique nonhermetic (not airtight), biocompatible micropackaging approaches based on the engineering of novel multilayer materials and thin film coatings.

To learn more about Prof. Wen Ko's amazing life and career, see page 2 of the APT Center's 2018 Scientific Report to the Community.

Pubmed Docs Published Work

Photo: (From the Micropackage Technology for Implantable Microsystems project.) The two pictures show great similarity in the morphology of tissues. Left is the control group of healthy skin. Right is the tissue around the implant. The pathological examinations showed normal tissue response to the implant; no evidence suggesting foreign body giant cell reaction, no scar formation and no inflammation.

 

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Professor Emeritus of Electrical Engineering & Applied Physics at Case Western Reserve University

Micropackage Technology for Implantable Microsystems