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Advanced Platform Technology Center

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Philip Feng, PhD

Philip Feng, PhDResearch interests
Nanoelectromechanical Systems (NEMS), Energy-Efficient Devices, Advanced Materials & Devices Engineering, Bio/Chemical Sensors & Biomedical Microsystems, RF/Microwave Devices & Circuits, Low-Noise Measurement & Precision Instruments

schematic of package layers; L & R tissue slides: Caption 1: Diagram of the packaged pressure telemetry device. Caption 2: The two pictures show great similarity in the morphology of the tissues. Left is the control group of healthy skin. Right is the tissue around the implant. The pathological examinations showed normal tissue response to the implant; no evidence suggesting foreign body giant cell reaction, no scar formation, and no inflammation.Dr. Feng works on the Micropackage Technology for Implantable Microsystems project. Implanted medical devices containing active electronics currently need to be hermetically sealed in titanium or ceramic packages, which limit their size, mechanical flexibility and integration with biological tissues. Investigators with the APT Center are developing unique nonhermetic (not airtight), biocompatible micropackaging approaches based on the engineering of novel multilayer materials and thin film coatings.

Pubmed Docs Published Work

Photo: (From the Micropackage Technology for Implantable Microsystems project.) The two pictures show great similarity in the morphology of tissues. Left is the control group of healthy skin. Right is the tissue around the implant. The pathological examinations showed normal tissue response to the implant; no evidence suggesting foreign body giant cell reaction, no scar formation and no inflammation.

 

Advanced Platform Technology Center