Advanced Platform Technology Center
Philip Feng, PhD
Nanoelectromechanical Systems (NEMS), Energy-Efficient Devices, Advanced Materials & Devices Engineering, Bio/Chemical Sensors & Biomedical Microsystems, RF/Microwave Devices & Circuits, Low-Noise Measurement & Precision Instruments
Dr. Feng works on the Micropackage Technology for Implantable Microsystems project. Implanted medical devices containing active electronics currently need to be hermetically sealed in titanium or ceramic packages, which limit their size, mechanical flexibility and integration with biological tissues. Investigators with the APT Center are developing unique nonhermetic (not airtight), biocompatible micropackaging approaches based on the engineering of novel multilayer materials and thin film coatings.
Photo: (From the Micropackage Technology for Implantable Microsystems project.) The two pictures show great similarity in the morphology of tissues. Left is the control group of healthy skin. Right is the tissue around the implant. The pathological examinations showed normal tissue response to the implant; no evidence suggesting foreign body giant cell reaction, no scar formation and no inflammation.